Nextreme Thermal Solutions
High efficiency capabilities for converting heat to electrical energy and for emplaced sensors and equipment
Nextreme Thermal Solutions designs and manufactures microscale thermal and power management products for the electronics, telecommunications, semiconductor, consumer, and defense/ aerospace industries. The company uses breakthrough thin-film thermoelectric material to embed cooling, temperature control, and power generation capabilities into the widely accepted copper pillar bumping process used in high-volume electronic packaging.
Whether trying to cool a hot spot, maintain operating temperature ranges for optimal performance, or channel heat away from sensitive electronics, Nextreme’s embedded thermoelectric cooling (eTEC) technology enables micro-scale thermal management products for precision control of heat and temperature. By cooling at the source with the smallest devices on the market, customers are offered a new approach to solving thermal design challenges. Nextreme’s devices are produced with standard semiconductor processing equipment, making eTEC components costeffective and scalable.
Nextreme’s embedded thermoelectric generator (eTEG) technology enables products that are optimized to provide power for high heat fluxes (>20W/cm2) in the smallest form factor. Nextreme thin-film thermoelectric generators produce electrical energy from waste heat for use in applications such as 1) powering gas sensors, 2) trickle charging wireless sensors in dark places; and 3) improving the fuel efficiency in automobiles among others.
Headquartered in Research Triangle Park, North Carolina, Nextreme was founded in 2004. IQT initially invested in Nextreme in October 2005. For more information about Nextreme, please visit www.nextreme.com.
Technology Focus Areas
- Physical and Biological Technologies
- Security
- Software and Infrastructure
